This paper presents a front-end application-specific integrated circuit (ASIC) that demonstrates the feasibility of inprobe digitization for next-generation miniature 3-D ultrasound probes with acceptable power- and area-efficiency. The proposed design employs a low-power charge-domain ADC that is directly merged with the sample-and-hold delay lines in each subarray, and high-speed datalinks at the ASIC periphery to realize an additional channel-count reduction compared to prior work based on analog subarray beamforming. The 4.8 × 2 mm2 ASIC, which has a compact layout element-matched to a 5-MHz 150-μm-pitch PZT matrix transducer, achieves an overall 36-fold channel-count reduction and a state-of-the-art power-efficiency with less than 1 mW/element power dissipation while receiving, which is acceptable even when scaled up to a 1000-element probe. The prototype ASIC has been fabricated in a 0.18 μm CMOS process. Its functionality has been successfully evaluated with both electrical and acoustical measurements.

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doi.org/10.1109/ULTSYM.2017.8091913, hdl.handle.net/1765/103761
2017 IEEE International Ultrasonics Symposium, IUS 2017
Department of Biomedical Engineering

Chen, C., Chen, Z., Bera, D., Noothout, E., Chang, Z. Y., Vos, R., Bosch, H., Verweij, M., de Jong, N.& Pertijs, M. (2017, October 31). A front-end ASIC for miniature 3-D ultrasound probes with in-probe receive digitization. IEEE International Ultrasonics Symposium, IUS. 2017 IEEE International Ultrasonics Symposium, IUS 2017, Washington, September 2017.https://doi.org/10.1109/ULTSYM.2017.8091913