Real-time 3D ultrasonic imaging requires a matrix of transducer elements with a number of elements that readily exceeds the number of channels of a conventional imaging system. This paper presents an ASIC, realized in a high-voltage 0.18 μm BCDMOS process, that interfaces a piezo-electric transducer array of 24 × 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels by means of a reconfigurable switch matrix and row-level low-noise amplifiers. Each element is associated with a compact bootstrapped high-voltage transmit/receive switch and programmable logic that enables a variety of imaging modes to be realized. The ASIC has been successfully used in a 3D imaging experiment.

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43rd IEEE European Solid State Circuits Conference, ESSCIRC 2017
Erasmus MC: University Medical Center Rotterdam

Kang, E. (E.), Ding, Q., Shabanimotlagh, M., Kruizinga, P., Chang, Z. Y., Noothout, E., … Pertijs, M. (2017). A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes. In ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference (pp. 211–214). doi:10.1109/ESSCIRC.2017.8094563