Reconfigurable hardware can be employed to tolerate permanent faults. Hardware components comprising a System-on-Chip can be partitioned into a handful of substitutable units interconnected with reconfigurable wires to allow isolation and replacement of faulty parts. This paper offers a probabilistic analysis of reconfigurable designs estimating for different fault densities the average number of fault-free components that can be constructed as well as the probability to guarantee a particular availability of components. Considering the area overheads of reconfigurability, we evaluate the resilience of various reconfigurable designs with different granularities. Based on this analysis, we conduct a comprehensive design-space exploration to identify the granularity mixes that maximize the fault-tolerance of a system. Our findings reveal that mixing fine-grain logic with a coarse-grain sparing approach tolerates up to 3× more permanent faults than component redundancy and 2× more than any other purely coarse-grain solution. Component redundancy is preferable at low fault densities, while coarse-grain and mixed-grain reconfigurability maximize availability at medium and high fault densities, respectively.

doi.org/10.1109/DFT.2014.6962074, hdl.handle.net/1765/86922
27th IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2014
Department of Neuroscience

Malek, A., Tzilis, S., Khan, D. A., Sourdis, I., Smaragdos, G., & Strydis, C. (2014). A probabilistic analysis of resilient reconfigurable designs. Presented at the 27th IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2014. doi:10.1109/DFT.2014.6962074